RevoDUR® – High Conductivity Trimetal Architecture

Copper based thermal spine architecture designed for extreme heat spreading and high performance industrial heat plates.

Engineering Platform Thermal Architecture Documentation
RevoDUR copper thermal spine architecture rendering
Architecture
Active Skin, copper Thermal Spine and Passive Skin.
Dimensions
Plate thickness, geometry and platform configurations.
Materials
Stainless steel surfaces with copper Thermal Spine.
Performance
Thermal conductivity and heat spreading behaviour.
Applications
Industrial heating plates and thermal systems.
Documentation
Technical data sheets and engineering documentation.

Copper Thermal Spine Architecture

RevoDUR® represents a high conductivity trimetal heat plate architecture within the Revolit Thermal Architecture Framework.

The structure consists of an Active Skin, a highly conductive Thermal Spine and a Passive Skin.

In contrast to bimetal architectures such as RevoTHERM®, RevoDUR® introduces a dedicated thermal spine layer designed to maximize lateral heat spreading.

The copper Thermal Spine enables extremely high thermal conductivity and rapid temperature homogenization across the plate surface.

Thermal Architecture Classification

Within the Revolit Thermal Architecture Framework RevoDUR® corresponds to Class IV – High Conductivity Trimetal Architecture.

Architectures such as RevoCORE® use an aluminium Thermal Spine to improve heat spreading, while RevoDUR® uses copper to achieve maximum thermal conductivity.

Beyond the serial-ready Class IV platform, customer-specific clad and multilayer architectures are implemented through RevoLAB®.